SuperView T3000 Hybrid 3D Optical Profilometer
Model | SuperView T3000 | SuperView T3200 |
Light Source | White Light LED | White Light LED |
Video System | 1024x1024 | 1024x1024 |
Interference Objective Lens | 10X (2.5X, 5X, 20X, 100X optional) | 10X (2.5X, 5X, 20X, 100X optional) |
Confocal Objective Lenses | 10X, 50X(5X, 20X, 100X optional) | 10X, 50X(5X, 20X, 100X optional) |
Standard Field of View | 1.2x1.2mm (10x) | 1.2x1.2mm (10x) |
Lens Turret | Motorized 5-hole turret | Motorized 5-hole turret |
XY Table Size | 200×200mm | 300×300mm |
XY Travel Range | 100×100mm | 200×200mm |
XY Load Capacity | 10kg | 10kg |
Control Mode | Motorized | Motorized |
Tilt | ±3° | ±3° |
Z - axis Travel Range | 100mm | 100mm |
Z - axis Control Mode | Motorized | Motorized |
Z Stroke Scanning Range | 10mm | 10mm |
Surface Topography Repeatability STR*1 | 0.1nm (White light interferometry) | 0.1nm (White light interferometry) |
Roughness RMS Repeatability*2 | 0.005nm (White light interferometry) | 0.005nm (White light interferometry) |
Step Height Measurement*3 | Accuracy: 0.5%; Repeatability: 0.1% (1σ) (White light interferometry) | Accuracy: 0.5%; Repeatability: 0.1% (1σ) (White light interferometry) |
The Hybrid 3D optical profilometer Superview T series is used for sub nanometer measurement of surfaces of various precision components and materials. It integrates the performance characteristics of two high-precision 3D measuring instruments, white light interferometer and confocal microscope, and can perform non-contact scanning of the samples surface then re-establish 3D surface image. When measuring the ultra smooth and transparent surfaces, white light interferometry mode can be used to obtain high-precision and distortion-free images, and analyze parameters such as roughness. When measuring coarse surfaces with sharp angle features, confocal microscopy mode can reconstruct large angle 3D topography images, and 2D & 3D parameters reflecting surface quality are obtained by data processing and analysis of surface 3D images through software.
Nano 3D Optical Surface Profilometers SuperView W3
Size | 1000*900*1550mm |
Weight | 500 kg |
Light source | White LED |
Video system | 1024×1024 |
Objective Lens | 10x(2.5x,5x,20x,50x,100x optional) |
Optical Zoom | 0.5x(0.75x,1x,0.375x optional) |
Standard F.O.V. | 0.98×0.98 mm |
Lens Turret | Motorized 5 holes-turret |
XY Size | 450×450mm |
XY Travel Range | 300×300mm |
XY Loading Capacity | 10kg |
XY Control Method | Motorized |
Tilt | ±5° Motorized |
Z Travel Range | 100mm |
Z Control Method | Motorized |
Z-Stoke Scanning Range | 10mm |
Z Resolution | 0.1nm |
Roughness RMS Repeatability *1 | 0.005nm |
Stage Height Accruacy *2 | 0.3% |
Stage Height Repeatability *2 | 0.08% 1σ |
SuperView W3 Optical 3D Surface profilometer is an ideal instrument for sub-Nanometer measurement of various precision parts. Based on the principle of white light interference technology, combined with precision Z-direction scanning module and 3D modeling algorithm, it contactlessly scans the surface of the object then establish a 3D image for the surface. A serial of 2D, 3D parameters reflecting surface quality of the object are obtained after XtremeVision software processes and analyzes the 3D image. The SuperView W3 is a user-friendly precision optical instrument with powerful analysis functions for all kinds of surface form & roughness parameters. With unique light source it could measure various precision parts with both smooth and rough surface.
Dedicated Functions for Semiconductor Field
- Measure profile trenches after laser grooving in the dicing process.
- Measure film step-height of wafer ranging from 1nm~1mm.
- Measure roughness of silicon cut sheet after grinding process, and can measure
- dozens of small areas to obtain the average value by one click.
- Support 6", 8" and 12" wafer measurement, and easy switch between 3 sizes of
- vacuum chucks by one click automatically.
